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8 layers mobile phone main board

8 layers mobile phone main board

8 layers mobile phone main board
8 layers mobile phone main board 8 layers mobile phone main board
  • Categories:
  • 8-Layer PCB
  • Number of Layers:
  • 8-Layer
  • Base Material:
  • FR4
  • Copper Thickness:
  • 1oz
  • Board Thickness:
  • 1.6mm
  • Min. Hole Size:
  • 0.25mm
  • Min. Line Width:
  • 0.12mm
  • Min. Line Spacing:
  • 0.12mm
  • Surface Finishing:
  • plated gold
  • Update Time:
  • 06/18/2013
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Detailed Info

8 layers mobile phone main board Detailed Production information:

Board thickness:1.6mm

Material:FR4

Layer: 8 layer

Copper thickess:1oz

Solder mask color: green

Surface finished: ENIG

Min. hole size: 0.2mm

Min.line width/space:0.1mm

Outline: CNC/punch

Test: E-test

Package:Inner Packing:vacuum packing
              Outer Packing:standard carton packing

8 layers mobile phone main board other information:

MOQ:1pcs

Lead time:12 working days

Payment: TT/Paypal/Western Union

8 layers mobile phone main board
  • 8 layers mobile phone main board
  • 8 layers mobile phone main board
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