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PCB Technology Capability
Items
Single/Double-sided Board/Multilayer Board/FPC（1-12 Layer）
Base Materials
FR-4 (High TG 150°- 170°) 、FR1,Aluminum,CEM-3、BT、94VO
Finish copper thickness
Outer 6 OZ, Inner 4 OZ
Surface finish
ENIG, ImAg, ImSn, OSP, HASL, Plating gold.
Finished Board Size
Max Double-sided Board
640 mm X 1100mm
Max Multilayer Board
640 mm X 1100mm
Finished Board Hole Size（PTH Hole）
Min Finished Board Hole Size
0.15 mm
Conductor Width and Spacing
Min Conductor Width
0.1mm
Min Conductor Spacing
0.1mm
Thickness of Plating and Coating Layer
PTH Wall Copper Thickness
>0.02mm
Tin Solder Thickness（Hot Air Leveling）
>0.02MM
Nickel/Gold Thickness
For customer special need
Nickel Plating Layer
>2 um
Gold Plating Layer
>0.3 um
Bare Board Test
Single Side Test
Max Test Point
20480
Max Board Test Size
400mmX300mm
Double Side Test
Max Test Point
40960(General Use)
4096(Special Use)
Max Board Test Size
406mm X 325mm
320mm X 400mm
Min Test pitch of SMT
0.5mm
Test Voltage
10-250V
Mechanical Process
Chamfer
20 °，30°，45°，60°
Angle Tolerance
±5°
Deepness Tolerance
±0.20 mm
V-Cut Angle
20 °，30°，45°
Board Thickness
0.1~3.2 mm
Residues Thickness
±0.025 mm
Cell Paraposition Precision
±0.025 mm
Tolerance of Out-shape Process
±0.1 mm
Board Warp
Max Value
0.7%
Optical Plotting
Max Plotting Area
660 mm X 558.8 mm
Precision
±0.01 mm
Repetitive Precision
±0.005 mm

 
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Gail Peng
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