Additional copper to the substrate, multilayer pcb the two sides sometimes usually by printed circuit boards (PCBs). Manufacturers, and removal of copper, so that the desired copper-hold circuit. This is called the subtractive method, additive technology, usually multi-layer the PCB. PCBs, including screen printing, plate making, and printed circuit board milling to create abatement There are several types.

1 Remove the metal screen printing. This printing process uses ink, etch resistance, to pay for the copper. Copper layer, and then immersed in a chemical solution, only to dissolve unprotected copper.

Two non-conductive plate, conductive ink, aluminum pcb and to eliminate unnecessary copper. Screen printing process, ink, conductive protection of copper. Electrochemical reaction, and then delete the unprotected copper.

3 Photoengrave on the PCB. The print mask Photoplotter use computer-aided manufacturing (CAM) software data. Place more than one copper layer mask and use of chemical etching to remove the substrate exposed copper.

4 employed as most of the PCB laser printer to print transparencies. However, laser technology is a direct replacement requirements of high-resolution transparencies.

5 implementation of the double sided pcb milling to remove the copper substrate. This technique uses two or three-axis mechanical milling system, the physical grinding unnecessary copper substrate. Functions of the machine, in a similar manner plotter and receive a description of the CAM software. Milling machine to use a specific format to create the output file of PCB design software.