How to remove metal from the printed circuit board
Additional copper to the substrate, multilayer pcb the two sides sometimes usually by printed circuit boards (PCBs). Manufacturers, and removal of copper, so that the desired copper-hold circuit. This is called the subtractive method, additive technology, usually multi-layer the PCB. PCBs, including screen printing, plate making, and printed circuit board milling to create abatement There are several types.
1 Remove the metal screen printing. This printing process uses ink, etch resistance, to pay for the copper. Copper layer, and then immersed in a chemical solution, only to dissolve unprotected copper.
Two non-conductive plate, conductive ink, aluminum pcb and to eliminate unnecessary copper. Screen printing process, ink, conductive protection of copper. Electrochemical reaction, and then delete the unprotected copper.
3 Photoengrave on the PCB. The print mask Photoplotter use computer-aided manufacturing (CAM) software data. Place more than one copper layer mask and use of chemical etching to remove the substrate exposed copper.
4 employed as most of the PCB laser printer to print transparencies. However, laser technology is a direct replacement requirements of high-resolution transparencies.
5 implementation of the double sided pcb milling to remove the copper substrate. This technique uses two or three-axis mechanical milling system, the physical grinding unnecessary copper substrate. Functions of the machine, in a similar manner plotter and receive a description of the CAM software. Milling machine to use a specific format to create the output file of PCB design software.